EKF - Short Profile
EKF - Short Profile

CompactPCI® Serial CPU Card

Elkhart Lake Intel® Atom™ x6000RE SoC


Ordering Information

Product Information

User Guide

Block Diagram

Backplane Resources

Application Notes
Power Event (Power Down)

Mezzanine Connectors

General Information
CompactPCI® Serial

Low Profile Mezzanine Modules (4HP Assembly)
S20 | S40 | S42 | S48 | S80 | S82

Side Cards (8HP/12HP Assembly)




Graphics | Ethernet | SATA

Photo Gallery

Low Profile Mezzanine Modules (4HP Assembly)

1 | 2 | 3 | 4 | 5 | 6 | 7 | 8

Side Boards (8HP/12HP Assembly)

1 | 2 | 3 | 4 | 5

© EKF • Images show up in a secondary browser tab or window


CompactPCI® Serial CPU Card

Low Power Intel® Atom™ x6000RE SoC (Elkhart Lake)

The SC8-FLUTE is a low power CompactPCI® Serial CPU board, based on an Intel® Atom™ x6000RE (Elkhart Lake Industrial) System-on-Chip processor. The front panel is provided with three 2.5Gbps RJ45 Ethernet jacks, and three Type-C USB3/DisplayPort connectors. The board is equipped with 16GB directly soldered DDR4 IBECC RAM, and in addition a DDR4 SODIMM socket for another 16GB.

High speed PCIe® x4 SSD mass storage is available via low profile mezzanine modules (4HP assembly), or multi-function side cards (8HP). The SC8-FLUTE backplane connectors comply with the CompactPCI® Serial system board specification, suitable for reasonable system expansion via 3 x PCIe®, 4 x SATA (two ports configurable as hardware RAID 0/1), and USB3.

SC8-FLUTE • Low Power CPU Board • Photo Soon Here

Feature Summary

  • CompactPCI® Serial (PICMG® CPCI-S.0) System Slot Controller
  • Form factor single size Eurocard (board dimensions 100x160mm2)
  • Mounting height 3U
  • Front panel width 4HP (8HP/12HP assembly with optional mezzanine side card)
  • Front panel I/O connectors for typical system configuration (3 x USB3/DisplayPort, 3 x 2.5Gbps Ethernet)
  • Backplane communication via CompactPCI® Serial connectors
  • On-board PCIe® mezzanine expansion option for mass storage modules or side cards
  • Side cards and low profile mass storage modules available as COTS and also as custom specific

  • Intel® Atom™ Industrial SoC x6000RE Series (Elkhart Lake)
  • x6425RE • 4 Cores • 1.9GHz • 12W TDP • 400MHz/32EUs Gfx
  • x6414RE • 4 Cores • 1.5GHz • 9W TDP • 400MHz/16EUs Gfx
  • x6212RE • 2 Cores • 1.2GHz • 6W TDP • 350MHz/16EUs Gfx
  • In-band ECC
  • Intel® Programmable Services Engine
  • Intel® Time Coordinate Computing (Intel® TCC) and TSN
  • Operating life 10 years up to 100% active
  • Ta -40°C to 85°C

  • Phoenix® UEFI (Unified Extensible Firmware Interface) with CSM*
  • Fully customizable by EKF
  • Secure Boot and Measured Boot supported
  • Windows®, Linux and other (RT)OS' supported
* CSM (Compatibility Support Module) emulates a legacy BIOS environment, which allows to boot a legacy operating system such as DOS, 32-bit Windows and some RTOS'

Main Memory
  • Integrated memory controller fo up to 32GB DDR4 w. IBECC, 3200MT/s
  • 16GB Soldered memory for rugged applications
  • 16GB SODIMM socket

Mass Storage
  • 128Mbit SPI Flash (UEFI firmware and customer application data)
  • SPI Flash 128Mbit (UEFI firmware and customer application data)
  • Option e•MMC (embedded MMC 5.0 64GByte soldered)
  • PCIe® based SSD module options via P-HSE1 & P-HSE2 mezzanine connectors
  • M.2 socket(s) on low profile mezzanine modules (4HP) or side cards (8HP)
  • Up to 2 x M.2 NVMe SSD size 2280, PCIe x4 (P-HSE1) and PCIe x1 (P-HSE2)
  • Up to 2 x 1TB as of current
  • Option custom specific mezzanine mass storage board design on request

  • Intel® UHD Graphics, 4kp60 (4096x2160@60Hz) on three simultaneous displays
  • 2D/3D Hardware acceleration
  • H.265/HEVC Decode/Encode
  • H.264 Decode/Encode
  • MPEG2 Decode
  • VC1/WMV9 Decode
  • VP8 Decode
  • VP9 Decode/Encode
  • JPEG/MPEG Decode/Encode
  • HDCP 2.3, PAVP
  • 3 x Type-C front panel connectors (DisplayPort Alternate Mode)
  • DisplayPort™ 1.4 MST (multiple displays if monitor is equipped with bridge chip)

  • Up to 11 Gigabit Ethernet networking interfaces in total
  • 3 x 2500BASE-T RJ45 front ports via SGMII PHYs Marvell® AQR115C
  • Option 8 x 1000BASE-T backplane w. S80-P6 mezzanine module - Marvell® Peridot switch
  • Option 4 x 1000BASE-T backplane w. S82-P6 mezzanine module - 4 x Intel® I210-IT NIC
  • Option 4 x 2500BASE-T RJ45 front w. SCJ-VEENA short side card - 4 x Intel® I225-IT NIC (8HP assy)
  • Option 4 x 1000BASE-T M12-X front w. SCL-RHYTHM short side card - 4 x Intel® I210-IT NIC (8HP assy)
  • TSN Precision time protocol (Time-Sensitive-Networking) as required for OPC UA and OpenAvnu
  • Enables ultra-reliable low-latency communication (URLLC)
  • Intel® Time Coordinated Computing (Intel® TCC) for time synchronisation and timeliness

EHL SoC I/O Usage
  • 3 x USB Type-C front panel connectors (DP Alt Mode)
  • 3 x 2.5GBASE-T SGMII PHYs to RJ45 front ports
  • 4 x PCIe® Gen3 to HSE1 mezzanine connector (configurable 1x4 or 4x1 links)
  • 4 x PCIe® Gen3 to HSE2 mezzanine connector (4x1 links via Gen3 switch)
  • 3 x PCIe® Gen3 to backplane connectors (x1 links, 1 derived from SoC, 2 x via Gen3 switch)
  • 1 x PCIe® Gen3 to 1:7 switch (1 x USB controller, 2 x backplane use, 4 x HSE2 mezzanine)
  • e•MMC 5.1 (ordering option, mass storage device up to 64GB)
  • 1 x SATA 3.2 for backplane usage
  • eSPI, Audio, I2C, UART, CAN-FD, Time Sync to mezzanine expansion connector N-EXP
  • TPM 2.0 module

Additional Building Blocks
  • Additional on-board devices, PCIe® based
  • PCIe® Gen3 packet switch PI7C9X3G808GP (8-port, 8-lane)
  • Quad port PCIe® USB3 controller TUSB7340 (Type-C, backplane, HSE1, RAID controller)
  • Option JMS562 USB to SATA RAID 0/1 controller (backplane SATA)

  • Trusted Platform Module
  • TPM 2.0 for highest level of certified platform protection
  • Infineon Optiga™ SLM9670 cryptographic processor
  • Conforming to TCG 2.0 specification
  • AES hardware acceleration support (Intel® AES-NI)

Front Panel I/O (4HP)
  • 3 x 2.5 Gigabit Ethernet RJ45 (2.5GBASE-T, 1000BASE-T, 100BASE-TX, 10BASE-Te)
  • 3 x DisplayPort (Type-C Alt Mode)
  • 3 x USB 3.0 Type-C (same as DP connectors)

Front Panel I/O (8HP)
  • Variety of side cards available, common front panel 8HP/12HP with CPU card
  • Various I/O ports e.g. UART, Audio, RJ45 Ethernet, M12-X Ethernet, Wireless (SMA)
  • Custom specific front panel and side card design

CompactPCI® Serial Backplane Resources
  • PICMG® CompactPCI® Serial CPU card (system slot controller)
  • Support for up to three PCIe® based CompactPCI® Serial peripheral boards, Gen3 x1 links
  • 1 x PCIe® derived from EHL SoC, 2 x PCIe® via PI7C9X3G808GP switch
  • Support for 1 x native SATA (6Gbps)
  • Option 3 x SATA in addition with JMS562 controller (2 x SATA RAID 0/1)
  • Support for 1 x USB2/3 (5Gbps) via TUSB7340 controller
  • Option 8 x Gigabit Ethernet Switch (S80-P6 low profile mezzanine module)
  • Option 4 x Gigabit Ethernet NICs (S82-P6 low profile mezzanine module)

Local Expansion
  • Mezzanine side card connectors for optional local expansion
  • HSE1 - High speed expansion connector, PCIe® Gen3 fully configurable, derived from EHL SoC
  • HSE2 - High speed expansion connector, PCIe® Gen3 configured 4x1, via PCIe® packet switch
  • EXP - Sideband expansion connector, e.g. eSPI, Audio, UART (from EHL SoC)
  • 4HP Low profile mezzanine module options (to be ordered separately)
  • S20-NVME Mezzanine module - 1 x M.2 2280 NVME SSD socket, 1 x Type-C USB F/P connector
  • S40-NVME Mezzanine module - 1 x M.2 2280 NVME SSD socket, 1 x M.2 2280 SATA SSD socket, 2 x Type-C USB F/P Connector
  • S42-MC Mezzanine module - 1 x M.2 2280 NVME SSD socket, 2 x Mini Card sockets
  • S48-SSD Mezzanine Module - 2 x M.2 2280 NVME SSD sockets, 1 x USB Type-C
  • S80-P6 Mezzanine module - 1 x M.2 2280 NVMe SSD socket, 8 x Gigabit Ethernet via P6 backplane connector
  • S82-P6 Mezzanine module - M.2 NVMe SSD & 4 x GbE NIC via P6 backplane connector
  • Custom specific module design
  • 8HP Mezzanine side card option (to be ordered separately)
  • SCJ-VEENA Quad RJ45 2.5GbE NIC & M.2 SSD storage
  • SCL-RHYTHM Quad M12-X GbE NIC & M.2 SSD storage
  • SCZ-NVM Dual M.2 NVMe SSD, quad UART
  • Custom specific side card design

Environmental & Regulatory
  • Designed & manufactured in Germany
  • ISO 9001 certified quality management
  • Long term availability
  • Rugged solution
  • Coating, sealing, underfilling on request
  • Lifetime application support
  • RoHS compliant
  • EC Regulatory EN55024, EN55032, EN62368-1
  • Operating temperature -40°C to +85°C (industrial temperature range)
  • Storage Temperature: -40°C to +85°C, max. Gradient 5°C/min
  • Humidity 5% ... 95% RH non Condensing
  • Altitude -300m ... +3000m
  • Shock 15g 0.33ms, 6g 6ms
  • Vibration 1g 5-2000Hz
  • MTBF tbd years

RT OS Board Support Packages & Driver
  • Available on request

  • General low power industrial computing, for x86 based software
  • Rugged systems (e.g. transportation, construction machines, harvester)
  • Data concentrator, router, gateway, kiosk systems, IoT
  • Stand-alone computer (fog computing), scalable via mezzanine I/O expansion options
  • Small modular CompactPCI® Serial systems for expansion with up to four peripheral cards

SC8-FLUTE • Simplified Block Diagram

SC8-FLUTE • Simplified Block Diagram
Ordering Information
Please refer to List 21 for popular SKUs